Wafer handling – Precision with a system
In semiconductor manufacturing, wafer handling is a critical part of highly automated systems and their interconnection. Silicon wafers have to be moved between stations highly dynamically and precisely with minimal vibrations, for example, during the loading and unloading of compartments, during sorting and alignment, as well as during transport and storage in cassettes (FOUP, FOSB, or open cassettes). Any deviation in positioning, dynamics, or synchronization can affect quality, stability, and throughput.
For OEMs, therefore, short cycle times, maximum positioning accuracy, and reproducible motion profiles are vital. At the same time, the requirements for "copy exact," international SEMI standards, and cybersecurity within the meaning of the Cyber Resilience Act are increasing.
The solution set "Wafer Handling" from Bosch Rexroth addresses these requirements with a preconfigured, modular automation kit based on ctrlX AUTOMATION – with optimally coordinated components for motion, drive, I/O, communication, and safety. OEMs receive a ready-to-use solution set for wafer handling systems that reduces engineering and integration work, shortens time to market, and at the same time ensures performance, compliance with standards, and cybersecurity.
Ready-to-use solution set for wafer handling
The solution set "Wafer Handling" combines optimally matched hardware and software for wafer handling systems in the semiconductor industry. The set is based on ctrlX COREplus with ctrlX OS and ctrlX MOTION as a powerful motion core. Using the MOTION API, OEMs can integrate their own motion functions, kinematics, and interfaces and protect their specific expertise.
Scalable drive solutions with ctrlX DRIVE (DC 48 V, AC 200/230 V or AC 400 V) as well as oversampling-capable ctrlX I/O enable highly dynamic, precise, and low-vibration movements, which are essential for short cycle times and reproducible processes in wafer handling.
Open interfaces such as OPC UA and EtherCAT ensure straightforward integration into existing semiconductor architectures. In addition, functional safety, cybersecurity in accordance with IEC 62443-4-2 SL2, and relevant SEMI standards support rapid certification and global deployment.
The result: a modularly expandable, future-proof automation package for high-performance and resilient wafer handling systems.